トップ > 最新情報 > 国際会議MNE2018(コペンハーゲン)に参加しました． 9/24-27,2018

国際会議MNE2018(コペンハーゲン)に参加しました． 9/24-27,2018

デンマーク・コペンハーゲンで開催された国際会議MNE2018に参加し，当研究室の学生及び曽根先生が発表を行いました．

Wan-Ting Chiu, "Silk/Ni-P/TiO2 Composite Material Prepared by Supercritical CO2 Promoted Electroless Plating for Flexible Photocatalytic Device Applications", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Takahiro Yamamoto, "Micro-Mechanical Properties of Defect-Free Nickel Electrodeposited at a High Growth Rate toward MEMS Devices", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Hitomi Watanabe, "Effects of Ti/Au Layered Structure on Temperature Dependence of Micro-Cantilever Structure Stability", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Takahiro Yamamoto, "Mechanical Property and Thermal Stability of Electrodeposited Au-Cu Alloys for Reliability of MEMS Devices", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Hideaki Nakajima, "Young’s Modulus of Ti/Au Micro-Cantilever by Resonance Frequency Method toward Au-Based MEMS Device", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Hao-chun Tang, "High Strength Electrodeposited Gold?Copper Alloys for MEMS Devices", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Ken Hashigata, "Mechanical Strength Enhancement of Ti/Au Layered Structure Evaluated by Micro-Bending Test", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Keisuke Asano, "Electrodeposited Au-Cu Alloy with High Yield Stress Evaluated by Micro-Bending Test", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Kyotaro Nitta, "Cu-Alloying Effect on Structure Stability of Au Micro-Cantilever", 44rd International Conference on Micro & Nano Engineering (MNE2018)., Sep-18

Wan-Ting Chiu, "Silk/Ni-P/TiO2 Composite Material Prepared by Supercritical CO2 Promoted Electroless Plating for Flexible Photocatalytic Device Applications", MNE2018., Sep-18

Takahiro Yamamoto, "Micro-Mechanical Properties of Defect-Free Nickel Electrodeposited at a High Growth Rate toward MEMS Devices", MNE2018., Sep-18

Hitomi Watanabe, "Effects of Ti/Au Layered Structure on Temperature Dependence of Micro-Cantilever Structure Stability", MNE2018., Sep-18

Takahiro Yamamoto, "Mechanical Property and Thermal Stability of Electrodeposited Au-Cu Alloys for Reliability of MEMS Devices", MNE2018., Sep-18

Hideaki Nakajima, "Young’s Modulus of Ti/Au Micro-Cantilever by Resonance Frequency Method toward Au-Based MEMS Device", MNE2018., Sep-18

Hao-chun Tang, "High Strength Electrodeposited Gold?Copper Alloys for MEMS Devices", MNE2018., Sep-18

Ken Hashigata, "Mechanical Strength Enhancement of Ti/Au Layered Structure Evaluated by Micro-Bending Test", MNE2018., Sep-18

Keisuke Asano, "Electrodeposited Au-Cu Alloy with High Yield Stress Evaluated by Micro-Bending Test", MNE2018., Sep-18

Kyotaro Nitta, "Cu-Alloying Effect on Structure Stability of Au Micro-Cantilever", MNE2018., Sep-18